From: gengler@tobor.labs.tek.com (Ken Gengler)
Subject: Re: The 25MHz IIsi
Organization: Tektronix
Lines: 17
X-UserAgent: Nuntius v1.1.1d17
X-XXDate: Wed, 21 Apr 93 14:12:00 GMT

In article <C5uFzp.Btp@willamette.edu> Thomas A. Herzog,
therzog@willamette.edu writes:
>   So I finally decided to risk this upgrade, FAQ in hand I've gathered
the
> pieces together.  The only problem is that I haven't been able to find
> anyone who's even heard of thermal tape/glue (which is what the FAQ
> recommends for attaching the heat sink)  I am just tempted to use duct
> tape here.... anyone hae any ideas for me for attaching the heat sink to
> the processor??  much thanks.

Just use a thin film of epoxy.  That!s what I did.  Epoxy conducts heat
fairly well.  And my heat sink gets warm to prove it.  I looked for the
stuff myself & my local EE jocks said to use epoxy.

Have fun.

Ken